8465.96.00.40/Wafer Edge Grinding Machine/Canada

Wafer Edge Grinding Machine from Canada

Precision grinder for chamfering and profiling wafer edges to prevent chipping during handling and processing in semiconductor lines. Ensures wafer integrity pre-fab. HTS 8465.96.0040 as specialized paring machine.

Duty Rate — Canada → United States

12.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify edge profiles (e.g

• full chamfer, half radius) per SEMI standards

• Document throughput rates matching high-volume wafer fabs

• Avoid declaring as 'universal grinder'; specify semiconductor wafer application

Wafer Edge Grinding Machine from Canada — Import Duty Rate | HTS 8465.96.00.40