Semiconductor Crystal Boule Grinder from Japan
Precision grinder that shapes silicon or compound semiconductor boules to exact diameters and grinds orientation flats indicating conductivity type. Prepares boules for wafer slicing in semiconductor fabs. HTS 8465.96.0040 covers it as a paring machine for hard semiconductor materials similar to woodworking.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Label with exact tolerances (e.g
• flatness <1 micron) to prove precision for semiconductor use
• Cross-reference with wafer slicing equipment in import manifests for consistent classification