Diamond Wire Wafer Slicing Saw for Silicon Boules from Japan
High-precision saw using diamond wire to slice ultra-thin wafers from monocrystalline silicon boules with minimal kerf loss. Critical for semiconductor wafer manufacturing yield. Classified in HTS 8465.96.0040 as a slicing machine for woodworking-hard materials per statistical note (b)(ii)(B).
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide wire tension and speed specs matching statistical note requirements for wafer slicing
• Include cleanroom compatibility certifications for semiconductor end-use validation