Diamond Wire Wafer Slicing Saw for Silicon Boules from Japan
High-precision saw using diamond wire to slice ultra-thin wafers from monocrystalline silicon boules with minimal kerf loss. Critical for semiconductor wafer manufacturing yield. Classified in HTS 8465.96.0040 as a slicing machine for woodworking-hard materials per statistical note (b)(ii)(B).
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide wire tension and speed specs matching statistical note requirements for wafer slicing
• Include cleanroom compatibility certifications for semiconductor end-use validation