Diamond Wire Wafer Slicing Saw for Silicon Boules from China
High-precision saw using diamond wire to slice ultra-thin wafers from monocrystalline silicon boules with minimal kerf loss. Critical for semiconductor wafer manufacturing yield. Classified in HTS 8465.96.0040 as a slicing machine for woodworking-hard materials per statistical note (b)(ii)(B).
Duty Rate — China → United States
19.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Provide wire tension and speed specs matching statistical note requirements for wafer slicing
• Include cleanroom compatibility certifications for semiconductor end-use validation