Czochralski Crystal Puller for Silicon Wafer Production from Japan
A specialized machine tool that uses the Czochralski method to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon. The boule is then sliced into wafers for semiconductor fabrication. Classified under HTS 8465.96.0040 as a splitting, slicing, or paring machine for woodworking due to its precision slicing capabilities on hard materials akin to wood processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Verify classification against Chapter 84 statistical notes for semiconductor wafer manufacturing equipment to confirm eligibility under this subheading
• Provide detailed technical specs and end-use certificates proving it's for boule pulling prior to wafer slicing to prevent reclassification