Czochralski Crystal Puller for Silicon Wafer Production from Germany
A specialized machine tool that uses the Czochralski method to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon. The boule is then sliced into wafers for semiconductor fabrication. Classified under HTS 8465.96.0040 as a splitting, slicing, or paring machine for woodworking due to its precision slicing capabilities on hard materials akin to wood processing.
Duty Rate — Germany → United States
12.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Verify classification against Chapter 84 statistical notes for semiconductor wafer manufacturing equipment to confirm eligibility under this subheading
• Provide detailed technical specs and end-use certificates proving it's for boule pulling prior to wafer slicing to prevent reclassification