Czochralski Crystal Puller for Silicon Wafer Production from Canada
A specialized machine tool that uses the Czochralski method to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon. The boule is then sliced into wafers for semiconductor fabrication. Classified under HTS 8465.96.0040 as a splitting, slicing, or paring machine for woodworking due to its precision slicing capabilities on hard materials akin to wood processing.
Duty Rate — Canada → United States
12.4%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Verify classification against Chapter 84 statistical notes for semiconductor wafer manufacturing equipment to confirm eligibility under this subheading
• Provide detailed technical specs and end-use certificates proving it's for boule pulling prior to wafer slicing to prevent reclassification