Crystal boule Slicing Multi-Wire Saw from Japan

Multi-wire saw using hundreds of diamond wires to simultaneously slice entire boule into hundreds of wafers, maximizing yield. Key equipment per statistical note (b)(ii)(B). Classifies under HTS 8465.96.0040 slicing machines.

Duty Rate — Japan → United States

12.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Import Tips

Include wire spacing (e.g

150-200μm) and boule size capacity specs

Provide installation requirements for cleanroom vibration control