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8465.96.00.40/Chemical Mechanical Wafer Polisher/Japan

Chemical Mechanical Wafer Polisher from Japan

CMP polisher that uses chemical slurry and mechanical pad to achieve atomic-level flatness on semiconductor wafers for device fabrication. Final prep step per statistical notes. Under HTS 8465.96.0040 for paring/polishing hard semiconductor materials.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Detail pad pressure, rotation speeds, and slurry chemistry matching fab standards

• Include endpoint detection system descriptions to distinguish from basic polishers

Chemical Mechanical Wafer Polisher from Japan — Import Duty Rate | HTS 8465.96.00.40