Chemical Mechanical Wafer Polisher from China
CMP polisher that uses chemical slurry and mechanical pad to achieve atomic-level flatness on semiconductor wafers for device fabrication. Final prep step per statistical notes. Under HTS 8465.96.0040 for paring/polishing hard semiconductor materials.
Duty Rate — China → United States
22.4%
Rate breakdown
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Detail pad pressure, rotation speeds, and slurry chemistry matching fab standards
• Include endpoint detection system descriptions to distinguish from basic polishers