8465.96.00.40/Chemical Mechanical Wafer Polisher/Canada

Chemical Mechanical Wafer Polisher from Canada

CMP polisher that uses chemical slurry and mechanical pad to achieve atomic-level flatness on semiconductor wafers for device fabrication. Final prep step per statistical notes. Under HTS 8465.96.0040 for paring/polishing hard semiconductor materials.

Duty Rate — Canada → United States

12.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Detail pad pressure, rotation speeds, and slurry chemistry matching fab standards

• Include endpoint detection system descriptions to distinguish from basic polishers

Chemical Mechanical Wafer Polisher from Canada — Import Duty Rate | HTS 8465.96.00.40