Chemical Mechanical Wafer Polisher from Canada
CMP polisher that uses chemical slurry and mechanical pad to achieve atomic-level flatness on semiconductor wafers for device fabrication. Final prep step per statistical notes. Under HTS 8465.96.0040 for paring/polishing hard semiconductor materials.
Duty Rate — Canada → United States
12.4%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Detail pad pressure, rotation speeds, and slurry chemistry matching fab standards
• Include endpoint detection system descriptions to distinguish from basic polishers