8465.91.00.27/Wafer Grinding and Lapping Machine/Japan

Wafer Grinding and Lapping Machine from Japan

Precision grinders and lappers process sliced semiconductor wafers to exact dimensional tolerances and flatness for fabrication. Classified under HTS 8465.91.00.27 as sawmill-related machines supporting wafer preparation workflow per statistical note (a)(ii)(C).

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Provide flatness tolerance specs (<1 micron) and slurry compatibility docs

• Pitfall: classifying as general grinder without semiconductor end-use proof

• Require supplier affidavits for stats note eligibility