8465.91.00.27/Wafer Grinding and Lapping Machine/Japan

Wafer Grinding and Lapping Machine from Japan

Precision grinders and lappers process sliced semiconductor wafers to exact dimensional tolerances and flatness for fabrication. Classified under HTS 8465.91.00.27 as sawmill-related machines supporting wafer preparation workflow per statistical note (a)(ii)(C).

Duty Rate — Japan → United States

13%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Provide flatness tolerance specs (<1 micron) and slurry compatibility docs

• Pitfall: classifying as general grinder without semiconductor end-use proof

• Require supplier affidavits for stats note eligibility

Wafer Grinding and Lapping Machine from Japan — Import Duty Rate | HTS 8465.91.00.27