Wafer Grinding and Lapping Machine from Germany
Precision grinders and lappers process sliced semiconductor wafers to exact dimensional tolerances and flatness for fabrication. Classified under HTS 8465.91.00.27 as sawmill-related machines supporting wafer preparation workflow per statistical note (a)(ii)(C).
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide flatness tolerance specs (<1 micron) and slurry compatibility docs
• Pitfall: classifying as general grinder without semiconductor end-use proof
• Require supplier affidavits for stats note eligibility