Wafer Grinding and Lapping Machine from Germany
Precision grinders and lappers process sliced semiconductor wafers to exact dimensional tolerances and flatness for fabrication. Classified under HTS 8465.91.00.27 as sawmill-related machines supporting wafer preparation workflow per statistical note (a)(ii)(C).
Duty Rate — Germany → United States
13%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide flatness tolerance specs (<1 micron) and slurry compatibility docs
• Pitfall: classifying as general grinder without semiconductor end-use proof
• Require supplier affidavits for stats note eligibility