Wafer Grinding and Lapping Machine from China
Precision grinders and lappers process sliced semiconductor wafers to exact dimensional tolerances and flatness for fabrication. Classified under HTS 8465.91.00.27 as sawmill-related machines supporting wafer preparation workflow per statistical note (a)(ii)(C).
Duty Rate — China → United States
40.5%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Provide flatness tolerance specs (<1 micron) and slurry compatibility docs
• Pitfall: classifying as general grinder without semiconductor end-use proof
• Require supplier affidavits for stats note eligibility