Semiconductor Wafer Slicing Saw from Japan
High-precision wafer slicing saws cut monocrystalline semiconductor boules into thin wafers for device fabrication. Under HTS 8465.91.00.27 as sawmill machines for semiconductor wafer preparation per statistical note (a)(ii)(B). Essential for slicing silicon or gallium arsenide boules in cleanroom environments.
Duty Rate — Japan → United States
13%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Submit boule-to-wafer process documentation to avoid reclassification; ensure diamond wire or blade specs meet precision tolerances
• Common issue: inadequate vibration isolation proofs for cleanroom use
• Partner with licensed customs brokers familiar with Chapter 84 stats notes