Semiconductor Wafer Slicing Saw from Japan
High-precision wafer slicing saws cut monocrystalline semiconductor boules into thin wafers for device fabrication. Under HTS 8465.91.00.27 as sawmill machines for semiconductor wafer preparation per statistical note (a)(ii)(B). Essential for slicing silicon or gallium arsenide boules in cleanroom environments.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Submit boule-to-wafer process documentation to avoid reclassification; ensure diamond wire or blade specs meet precision tolerances
• Common issue: inadequate vibration isolation proofs for cleanroom use
• Partner with licensed customs brokers familiar with Chapter 84 stats notes