8465.91.00.27/Multi-Wire Wafer Saws for Silicon/Mexico

Multi-Wire Wafer Saws for Silicon from Mexico

Multi-wire saws simultaneously slice multiple semiconductor wafers from silicon ingots using diamond wire for high throughput. HTS 8465.91.00.27 covers these as advanced sawmill machines in wafer manufacturing per official statistical notes.

Duty Rate — Mexico → United States

13%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Include wire tension and kerf loss data in entries; ensure cleanroom class certification

• Common error: undervaluing based on wire consumables exclusion