Multi-Wire Wafer Saws for Silicon from Mexico
Multi-wire saws simultaneously slice multiple semiconductor wafers from silicon ingots using diamond wire for high throughput. HTS 8465.91.00.27 covers these as advanced sawmill machines in wafer manufacturing per official statistical notes.
Duty Rate — Mexico → United States
13%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include wire tension and kerf loss data in entries; ensure cleanroom class certification
• Common error: undervaluing based on wire consumables exclusion