8465.91.00.27/Multi-Wire Wafer Saws for Silicon/Japan

Multi-Wire Wafer Saws for Silicon from Japan

Multi-wire saws simultaneously slice multiple semiconductor wafers from silicon ingots using diamond wire for high throughput. HTS 8465.91.00.27 covers these as advanced sawmill machines in wafer manufacturing per official statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include wire tension and kerf loss data in entries; ensure cleanroom class certification

• Common error: undervaluing based on wire consumables exclusion