Multi-Wire Wafer Saws for Silicon from Germany
Multi-wire saws simultaneously slice multiple semiconductor wafers from silicon ingots using diamond wire for high throughput. HTS 8465.91.00.27 covers these as advanced sawmill machines in wafer manufacturing per official statistical notes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include wire tension and kerf loss data in entries; ensure cleanroom class certification
• Common error: undervaluing based on wire consumables exclusion