Multi-Wire Wafer Saws for Silicon from Canada
Multi-wire saws simultaneously slice multiple semiconductor wafers from silicon ingots using diamond wire for high throughput. HTS 8465.91.00.27 covers these as advanced sawmill machines in wafer manufacturing per official statistical notes.
Duty Rate — Canada → United States
13%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Include wire tension and kerf loss data in entries; ensure cleanroom class certification
• Common error: undervaluing based on wire consumables exclusion