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8465.91.00.27/Crystal Grinder for Wafer Diameters/Japan

Crystal Grinder for Wafer Diameters from Japan

Grinds semiconductor crystal boules to precise diameters and flats indicating conductivity/resistivity before slicing. HTS 8465.91.00.27 as sawmill prep machines matching statistical note (a)(ii)(A) crystal grinders.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Document flat grinding for resistivity marking; avoid general tool classification