Crystal Boule Slicing Machine from Japan
Designed to slice semiconductor crystal boules into wafers using inner-diameter or wire saw technology. Fits HTS 8465.91.00.27 for other sawmill machines in wood/semiconductor working, directly matching statistical note for wafer slicing saws.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Label as 'sawmill machine for semiconductor boule sawing' with HTS stats reference
• Avoid pitfalls like missing material compatibility certs for silicon/GaAs
• Update bills of lading with precise technical parameters