Crystal Boule Slicing Machine from China
Designed to slice semiconductor crystal boules into wafers using inner-diameter or wire saw technology. Fits HTS 8465.91.00.27 for other sawmill machines in wood/semiconductor working, directly matching statistical note for wafer slicing saws.
Duty Rate — China → United States
38%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Label as 'sawmill machine for semiconductor boule sawing' with HTS stats reference
• Avoid pitfalls like missing material compatibility certs for silicon/GaAs
• Update bills of lading with precise technical parameters