Automated Wafer Polishing Saw Line from Mexico
Integrated line combining slicing, grinding, and polishing for semiconductor wafers from boules. Classified in HTS 8465.91.00.27 for complete sawmill systems per wafer prep notes.
Duty Rate — Mexico → United States
13%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Break down line components for valuation; ensure system integration certs