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8465.91.00.27/Automated Wafer Polishing Saw Line/Japan

Automated Wafer Polishing Saw Line from Japan

Integrated line combining slicing, grinding, and polishing for semiconductor wafers from boules. Classified in HTS 8465.91.00.27 for complete sawmill systems per wafer prep notes.

Duty Rate — Japan → United States

13%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Break down line components for valuation; ensure system integration certs

Automated Wafer Polishing Saw Line from Japan — Import Duty Rate | HTS 8465.91.00.27