Automated Wafer Polishing Saw Line from Japan
Integrated line combining slicing, grinding, and polishing for semiconductor wafers from boules. Classified in HTS 8465.91.00.27 for complete sawmill systems per wafer prep notes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Break down line components for valuation; ensure system integration certs