8465.91.00.27/Automated Wafer Polishing Saw Line/Japan

Automated Wafer Polishing Saw Line from Japan

Integrated line combining slicing, grinding, and polishing for semiconductor wafers from boules. Classified in HTS 8465.91.00.27 for complete sawmill systems per wafer prep notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Break down line components for valuation; ensure system integration certs