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8465.91.00.27/Automated Wafer Polishing Saw Line/Germany

Automated Wafer Polishing Saw Line from Germany

Integrated line combining slicing, grinding, and polishing for semiconductor wafers from boules. Classified in HTS 8465.91.00.27 for complete sawmill systems per wafer prep notes.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Break down line components for valuation; ensure system integration certs

Automated Wafer Polishing Saw Line from Germany — Import Duty Rate | HTS 8465.91.00.27