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8465.91.00.27/Automated Wafer Polishing Saw Line/China

Automated Wafer Polishing Saw Line from China

Integrated line combining slicing, grinding, and polishing for semiconductor wafers from boules. Classified in HTS 8465.91.00.27 for complete sawmill systems per wafer prep notes.

Duty Rate — China → United States

40.5%

Rate breakdown

9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
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Import Tips

• Break down line components for valuation; ensure system integration certs