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8465.91.00.27/Automated Wafer Polishing Saw Line/Canada

Automated Wafer Polishing Saw Line from Canada

Integrated line combining slicing, grinding, and polishing for semiconductor wafers from boules. Classified in HTS 8465.91.00.27 for complete sawmill systems per wafer prep notes.

Duty Rate — Canada → United States

13%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Break down line components for valuation; ensure system integration certs

Automated Wafer Polishing Saw Line from Canada — Import Duty Rate | HTS 8465.91.00.27