Silicon Ingot Grinder from China
Precision grinder that shapes semiconductor silicon ingots to exact diameters and flats indicating conductivity type, preparing them for wafer slicing. Falls under HTS 8464.90.0120 per statistical notes as crystal grinders for semiconductor materials treated like mineral processing tools. Critical step in wafer preparation.
Duty Rate — China → United States
39.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Include material safety data sheets for silicon dust handling compliance
• Label as 'semiconductor crystal grinder' to match HTS statistical definition