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8464.90.01.20/SiC Wafer Grinder/Japan

SiC Wafer Grinder from Japan

Grinder for silicon carbide (SiC) power semiconductor wafers, handling extreme hardness of ceramic-like material. Fits HTS 8464.90.0120 as processing ceramics/minerals for semiconductor use. Enables high-voltage device production.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• SiC-specific hardness (Mohs 9.5) justifies specialized classification

• Export controls may apply—check BIS licensing

• Bulk ceramic imports get different rates

SiC Wafer Grinder from Japan — Import Duty Rate | HTS 8464.90.01.20