8464.90.01.20/SiC Wafer Grinder/Japan

SiC Wafer Grinder from Japan

Grinder for silicon carbide (SiC) power semiconductor wafers, handling extreme hardness of ceramic-like material. Fits HTS 8464.90.0120 as processing ceramics/minerals for semiconductor use. Enables high-voltage device production.

Duty Rate — Japan → United States

12%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• SiC-specific hardness (Mohs 9.5) justifies specialized classification

• Export controls may apply—check BIS licensing

• Bulk ceramic imports get different rates

SiC Wafer Grinder from Japan — Import Duty Rate | HTS 8464.90.01.20