SiC Wafer Grinder from Germany
Grinder for silicon carbide (SiC) power semiconductor wafers, handling extreme hardness of ceramic-like material. Fits HTS 8464.90.0120 as processing ceramics/minerals for semiconductor use. Enables high-voltage device production.
Duty Rate — Germany → United States
12%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• SiC-specific hardness (Mohs 9.5) justifies specialized classification
• Export controls may apply—check BIS licensing
• Bulk ceramic imports get different rates