SiC Wafer Grinder from Germany
Grinder for silicon carbide (SiC) power semiconductor wafers, handling extreme hardness of ceramic-like material. Fits HTS 8464.90.0120 as processing ceramics/minerals for semiconductor use. Enables high-voltage device production.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• SiC-specific hardness (Mohs 9.5) justifies specialized classification
• Export controls may apply—check BIS licensing
• Bulk ceramic imports get different rates