SiC Wafer Grinder from China

Grinder for silicon carbide (SiC) power semiconductor wafers, handling extreme hardness of ceramic-like material. Fits HTS 8464.90.0120 as processing ceramics/minerals for semiconductor use. Enables high-voltage device production.

Duty Rate — China → United States

37%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

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Import Tips

• SiC-specific hardness (Mohs 9.5) justifies specialized classification

• Export controls may apply—check BIS licensing

• Bulk ceramic imports get different rates