8464.90.01.20/Semiconductor Wafer Edge Grinder/Japan

Semiconductor Wafer Edge Grinder from Japan

Post-slicing edge grinder that profiles semiconductor wafer edges for handling and prevents chipping during fabrication. HTS 8464.90.0120 as it cold works silicon/glass-like semiconductor wafers akin to mineral materials. Improves yield in wafer processing lines.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include wafer thickness specs (e.g

• 300μm) to prove semiconductor use

• Customs may require demo videos showing edge profiling function