Semiconductor Wafer Edge Grinder from Germany
Post-slicing edge grinder that profiles semiconductor wafer edges for handling and prevents chipping during fabrication. HTS 8464.90.0120 as it cold works silicon/glass-like semiconductor wafers akin to mineral materials. Improves yield in wafer processing lines.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include wafer thickness specs (e.g
• 300μm) to prove semiconductor use
• Customs may require demo videos showing edge profiling function