Semiconductor Wafer Edge Grinder from Germany
Post-slicing edge grinder that profiles semiconductor wafer edges for handling and prevents chipping during fabrication. HTS 8464.90.0120 as it cold works silicon/glass-like semiconductor wafers akin to mineral materials. Improves yield in wafer processing lines.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include wafer thickness specs (e.g
• 300μm) to prove semiconductor use
• Customs may require demo videos showing edge profiling function