Gallium Arsenide Boule Grinder from Japan
Specialized grinder for GaAs compound semiconductor boules, achieving dimensional tolerances for wafer production. Classified in 8464.90.0120 as processing semiconductor materials like ceramics/minerals. Handles brittle III-V materials requiring diamond tooling.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide GaAs-specific tooling certifications for duty preference claims
• Hazardous material declarations required for arsenic compounds
• Avoid misclassification by specifying 'cold working' non-glass functions