Gallium Arsenide Boule Grinder from Japan
Specialized grinder for GaAs compound semiconductor boules, achieving dimensional tolerances for wafer production. Classified in 8464.90.0120 as processing semiconductor materials like ceramics/minerals. Handles brittle III-V materials requiring diamond tooling.
Duty Rate — Japan → United States
12%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide GaAs-specific tooling certifications for duty preference claims
• Hazardous material declarations required for arsenic compounds
• Avoid misclassification by specifying 'cold working' non-glass functions