8464.90.01.20/Float Zone Crystal Grinder/Japan

Float Zone Crystal Grinder from Japan

Grinding machine for float zone method silicon boules, creating precise flats and diameters for resistivity indication before wafer slicing. HTS 8464.90.0120 applies as it processes semiconductor crystals like mineral materials per chapter notes. Used in high-purity semiconductor production.

Duty Rate — Japan → United States

12%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Demonstrate float zone compatibility via technical specs to justify classification

• Comply with cleanroom import standards; certify non-contaminating materials