8464.90.01.20/Diamond Wafer Lapper/Japan

Diamond Wafer Lapper from Japan

Lapping machine using diamond slurry to achieve flatness tolerances on semiconductor wafers before polishing. HTS 8464.90.0120 covers wafer grinders/lappers/polishers as mineral material working tools per notes. Prepares wafer surface for device fabrication.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter

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Import Tips

• Specify diamond grit size and flatness specs (e.g

• <1μm) for verification

• Slurry system classified separately—declare as parts

• EU REACH compliance for diamond abrasives