Diamond Wafer Lapper from Japan
Lapping machine using diamond slurry to achieve flatness tolerances on semiconductor wafers before polishing. HTS 8464.90.0120 covers wafer grinders/lappers/polishers as mineral material working tools per notes. Prepares wafer surface for device fabrication.
Duty Rate — Japan → United States
12%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify diamond grit size and flatness specs (e.g
• <1μm) for verification
• Slurry system classified separately—declare as parts
• EU REACH compliance for diamond abrasives