8464.90.01.20/Diamond Wafer Lapper/Japan

Diamond Wafer Lapper from Japan

Lapping machine using diamond slurry to achieve flatness tolerances on semiconductor wafers before polishing. HTS 8464.90.0120 covers wafer grinders/lappers/polishers as mineral material working tools per notes. Prepares wafer surface for device fabrication.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify diamond grit size and flatness specs (e.g

• <1μm) for verification

• Slurry system classified separately—declare as parts

• EU REACH compliance for diamond abrasives