Diamond Wafer Lapper from Germany
Lapping machine using diamond slurry to achieve flatness tolerances on semiconductor wafers before polishing. HTS 8464.90.0120 covers wafer grinders/lappers/polishers as mineral material working tools per notes. Prepares wafer surface for device fabrication.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify diamond grit size and flatness specs (e.g
• <1μm) for verification
• Slurry system classified separately—declare as parts
• EU REACH compliance for diamond abrasives