8463.90.00.40/Used Wafer Surface Polisher/Japan

Used Wafer Surface Polisher from Japan

Rebuilt polisher achieving sub-angstrom surface roughness on silicon wafers for device fabrication. Classifies 8463.90.0040 as used metalworking without removal for semiconductor prep. Critical mirror finish step.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Specify RMS surface roughness achievable (<0.5nm)

• Document pad conditioning system status

• Ensure cleanroom compatibility certification