Used Wafer Surface Polisher from Japan
Rebuilt polisher achieving sub-angstrom surface roughness on silicon wafers for device fabrication. Classifies 8463.90.0040 as used metalworking without removal for semiconductor prep. Critical mirror finish step.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify RMS surface roughness achievable (<0.5nm)
• Document pad conditioning system status
• Ensure cleanroom compatibility certification