8463.90.00.40/Used Wafer Surface Polisher/Japan

Used Wafer Surface Polisher from Japan

Rebuilt polisher achieving sub-angstrom surface roughness on silicon wafers for device fabrication. Classifies 8463.90.0040 as used metalworking without removal for semiconductor prep. Critical mirror finish step.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify RMS surface roughness achievable (<0.5nm)

• Document pad conditioning system status

• Ensure cleanroom compatibility certification