8463.90.00.40/Rebuilt Wafer Back Grinder/Mexico

Rebuilt Wafer Back Grinder from Mexico

Used grinder for thinning wafer backsides to target thickness for device processing. HTS 8463.90.0040 for rebuilt cermet tools. Achieves TTV <1um specifications.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico

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Import Tips

• Include thickness measurement system calibration records

• Specify carrier wafer handling capability

• Check for temporary bond/debond features