Rebuilt Wafer Back Grinder from Japan
Used grinder for thinning wafer backsides to target thickness for device processing. HTS 8463.90.0040 for rebuilt cermet tools. Achieves TTV <1um specifications.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include thickness measurement system calibration records
• Specify carrier wafer handling capability
• Check for temporary bond/debond features