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8463.90.00.40/Rebuilt Wafer Back Grinder/Japan

Rebuilt Wafer Back Grinder from Japan

Used grinder for thinning wafer backsides to target thickness for device processing. HTS 8463.90.0040 for rebuilt cermet tools. Achieves TTV <1um specifications.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include thickness measurement system calibration records

• Specify carrier wafer handling capability

• Check for temporary bond/debond features

Rebuilt Wafer Back Grinder from Japan — Import Duty Rate | HTS 8463.90.00.40