8463.90.00.40/Rebuilt Wafer Back Grinder/Germany

Rebuilt Wafer Back Grinder from Germany

Used grinder for thinning wafer backsides to target thickness for device processing. HTS 8463.90.0040 for rebuilt cermet tools. Achieves TTV <1um specifications.

Duty Rate — Germany → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Include thickness measurement system calibration records

• Specify carrier wafer handling capability

• Check for temporary bond/debond features