8463.90.00.40/Rebuilt Wafer Back Grinder/Germany

Rebuilt Wafer Back Grinder from Germany

Used grinder for thinning wafer backsides to target thickness for device processing. HTS 8463.90.0040 for rebuilt cermet tools. Achieves TTV <1um specifications.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

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Import Tips

• Include thickness measurement system calibration records

• Specify carrier wafer handling capability

• Check for temporary bond/debond features