Rebuilt Semiconductor Wafer Slicing Saw from Germany
Used inner-diameter saw rebuilt for slicing thin wafers from monocrystalline silicon boules with minimal kerf loss. HTS 8463.90.0040 covers this as rebuilt metalworking saw without primary material removal intent. Critical for high-yield wafer production.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include diamond blade specs and slicing tolerance data for customs valuation
• Certify saw alignment post-rebuild to confirm functionality
• Declare as 'precision saw for cermets' to match tariff description