Rebuilt Semiconductor Wafer Slicing Saw from Canada
Used inner-diameter saw rebuilt for slicing thin wafers from monocrystalline silicon boules with minimal kerf loss. HTS 8463.90.0040 covers this as rebuilt metalworking saw without primary material removal intent. Critical for high-yield wafer production.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Include diamond blade specs and slicing tolerance data for customs valuation
• Certify saw alignment post-rebuild to confirm functionality
• Declare as 'precision saw for cermets' to match tariff description