8463.90.00.40/Rebuilt Semiconductor Wafer Slicing Saw/Canada

Rebuilt Semiconductor Wafer Slicing Saw from Canada

Used inner-diameter saw rebuilt for slicing thin wafers from monocrystalline silicon boules with minimal kerf loss. HTS 8463.90.0040 covers this as rebuilt metalworking saw without primary material removal intent. Critical for high-yield wafer production.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Include diamond blade specs and slicing tolerance data for customs valuation

• Certify saw alignment post-rebuild to confirm functionality

• Declare as 'precision saw for cermets' to match tariff description

Rebuilt Semiconductor Wafer Slicing Saw from Canada — Import Duty Rate | HTS 8463.90.00.40