8461.90.30.40/Makino G5-A5G NC Planing Center/Japan

Makino G5-A5G NC Planing Center from Japan

Advanced numerically controlled planing center for high-precision surfacing of cermet tools used in semiconductor wafer slicing saws. Under HTS 8461.90.3040 as other NC planing machines for metal/cermet removal. Ensures surface flatness for accurate wafer thickness control.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Calculate with your customs value Verify classification with AI

Import Tips

• Document cermet compatibility to leverage broader classification scope beyond pure metals

• FTA claims require proof of NC origin; retain controller programming logs