DMG Mori NLX 2500/1250 CNC Planing Machine from Canada
A numerically controlled planing machine designed for high-precision metal removal on large workpieces in semiconductor manufacturing, specifically for planing crystal boules prior to wafer slicing. It falls under HTS 8461.90.3040 as a numerically controlled planing machine for metalworking, not elsewhere specified. This equipment ensures flatness tolerances critical for downstream wafer processing.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Verify numerical control certification and machine specifications to confirm classification under 8461.90.3040, avoiding reclassification to non-NC tools
• Include detailed technical datasheets showing metal/cermet removal capability and planing function for customs valuation