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8461.50.80.90/Wafer Lapping Machine/Mexico

Wafer Lapping Machine from Mexico

Double-sided lapper removing stock from semiconductor wafers to achieve total thickness variation <1 micron before polishing. HTS 8461.50.80.90 for other cutting-off/abrasive machines in wafer preparation.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Document TTV specs and slurry composition for classification

• Consider temporary imports for installation under TIB program