Wafer Lapping Machine from Mexico
Double-sided lapper removing stock from semiconductor wafers to achieve total thickness variation <1 micron before polishing. HTS 8461.50.80.90 for other cutting-off/abrasive machines in wafer preparation.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document TTV specs and slurry composition for classification
• Consider temporary imports for installation under TIB program