8461.50.80.90/Wafer Lapping Machine/Japan

Wafer Lapping Machine from Japan

Double-sided lapper removing stock from semiconductor wafers to achieve total thickness variation <1 micron before polishing. HTS 8461.50.80.90 for other cutting-off/abrasive machines in wafer preparation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document TTV specs and slurry composition for classification

• Consider temporary imports for installation under TIB program