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8461.50.80.90/Wafer Lapping Machine/Germany

Wafer Lapping Machine from Germany

Double-sided lapper removing stock from semiconductor wafers to achieve total thickness variation <1 micron before polishing. HTS 8461.50.80.90 for other cutting-off/abrasive machines in wafer preparation.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Document TTV specs and slurry composition for classification

• Consider temporary imports for installation under TIB program