8461.50.80.90/Wafer Lapping Machine/Canada

Wafer Lapping Machine from Canada

Double-sided lapper removing stock from semiconductor wafers to achieve total thickness variation <1 micron before polishing. HTS 8461.50.80.90 for other cutting-off/abrasive machines in wafer preparation.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter

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Import Tips

• Document TTV specs and slurry composition for classification

• Consider temporary imports for installation under TIB program