Wafer Grinder for Dimensional Control from Mexico
Backside grinders thinning wafers to 50-100 micron specs for advanced packaging with stress relief. Classified HTS 8461.50.80.90 other machine tools for semiconductor wafer processing.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Tape frame compatibility specs prove semiconductor application
• ITAR/EAR classification for advanced node equipment